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010 _a0931837057
090 _a16675
099 _tOUVR
_zALEX33070
100 _a19870514d1985 k y0frey50 ba
101 0 _aeng
_2639-2
102 _aUS
105 _aa a 101yy
106 _ar
181 _6z01
_ctxt
_2rdacontent
181 1 _6z01
_ai#
_bxxxe##
182 _6z01
_cn
_2rdamedia
182 1 _6z01
_an
183 1 _6z01
_anga
_2RDAfrCarrier
200 1 _aElectronic packaging materials science
_eSymposium held at the 1984 Materials Research Society Meeting, November 27-29, in Boston, Massachusetts
_feditors Edward A. Giess, King-Ning Tu, Donald R. Uhlmann
210 _aPittsburgh (Pa.)
_cMaterials Research Society
_dcop. 1985
215 _a1 volume (xii-417 p.)
_cill.
_d24 cm
225 2 _aMaterials Research Society symposia proceedings
_v40
320 _aRéférences bibliogr. en fin de chapitres. Index
410 _0013338315
_tMaterials Research Society symposia proceedings
_x0272-9172
_v40
606 _3031690645
_aEncapsulation (électronique)
_3027282457
_xMatériaux
_2rameau
608 _302886431X
_aActes de congrès
_2rameau
701 1 _3128507721
_aGiess
_bEdward A.
_4651
701 1 _3031667945
_aTu
_bKing-ning
_f1937-....
_4651
701 1 _3033270600
_aUhlmann
_bDonald Robert
_4651