000 | 01429cam0a2200361 4500 | ||
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001 | 16675 | ||
009 | 005352304 | ||
003 | http://www.sudoc.fr/005352304 | ||
005 | 20250630092627.0 | ||
010 | _a0931837057 | ||
090 | _a16675 | ||
099 |
_tOUVR _zALEX33070 |
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100 | _a19870514d1985 k y0frey50 ba | ||
101 | 0 |
_aeng _2639-2 |
|
102 | _aUS | ||
105 | _aa a 101yy | ||
106 | _ar | ||
181 |
_6z01 _ctxt _2rdacontent |
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181 | 1 |
_6z01 _ai# _bxxxe## |
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182 |
_6z01 _cn _2rdamedia |
||
182 | 1 |
_6z01 _an |
|
183 | 1 |
_6z01 _anga _2RDAfrCarrier |
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200 | 1 |
_aElectronic packaging materials science _eSymposium held at the 1984 Materials Research Society Meeting, November 27-29, in Boston, Massachusetts _feditors Edward A. Giess, King-Ning Tu, Donald R. Uhlmann |
|
210 |
_aPittsburgh (Pa.) _cMaterials Research Society _dcop. 1985 |
||
215 |
_a1 volume (xii-417 p.) _cill. _d24 cm |
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225 | 2 |
_aMaterials Research Society symposia proceedings _v40 |
|
320 | _aRéférences bibliogr. en fin de chapitres. Index | ||
410 |
_0013338315 _tMaterials Research Society symposia proceedings _x0272-9172 _v40 |
||
606 |
_3031690645 _aEncapsulation (électronique) _3027282457 _xMatériaux _2rameau |
||
608 |
_302886431X _aActes de congrès _2rameau |
||
701 | 1 |
_3128507721 _aGiess _bEdward A. _4651 |
|
701 | 1 |
_3031667945 _aTu _bKing-ning _f1937-.... _4651 |
|
701 | 1 |
_3033270600 _aUhlmann _bDonald Robert _4651 |